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Microelectronic Design

Unit 3: Integrated Circuit Packaging

Unit Overview

This Unit covers the topic of Integrated Circuit Packaging

Unit Contents

• 3.1 Introduction
• 3.2 Design Considerations
  • 3.2.1  Electrical Considerations
  • 3.2.2 Thermal Considerations
• 3.3 IC Packaging Technologies
  • 3.3.1  Chip Package Connection
  • 3.3.2  Chip Packages
• 3.4 Package Cooling Considerations
• 3.5 Package Sealing and Encapsulation
• 3.6 WWW Research
• 3.7 Self Assessment Questions

NOTE: If you require further detailed information on packaging you can refer to

Microelectronics Packaging Handbook, 
Edited by Rao R Tummala, 
Eugene J Rymaszewski. Van Nostrand Reinhold. 
ISBN: 0-412-08561-5
Vols 1,2,3.
Also available on CD-ROM.

However this is a specialised book which is not held in many libraries. The library at Bolton has one copy.

3.1 Introduction

• Packaging of ICs is the ability to establish interconnections between the chip and package and package to PCB, etc. and maintain a suitable operating environment for the IC to function effectively and efficiently.
• Key aspects are topological, electrical, thermal and reliability.
• IC package has four major functions:
• Power distribution, involving EM, structural and material aspects.
• Signal distribution, involving topological and EM aspects.
• Heat dissipation (cooling), involving structural and material considerations.
• Circuit protection, (mechanical, chemical, EM) of components and interconnections.

Packaging process must be cheap, mechanically robustand reliable.

Figure 3.1 Four major functions of the package

Figure 3.2 Commercial IC

3.2 Design Considerations

Successful package will satisfy all application requirements at an acceptable design, manufacturing and operating cost.

Improving technology increases the demands on the number and density of package pins and interconnections demanding reduced physical dimensions requiring the use of improved techniques.

Need to improve quality and reliability of the packaging process important.

Number of connections (pin-out) a major cost factor and strongly dependent on IC function, eg. memories require few connection pins but random logic requires many more.

The number of terminals (pins) required and the number of circuits are related by Rent's Rule which states that

N = KM^p  where N is the number of input-output terminals required, K is the average number of terminals used for an individual logic circuit, M is the total number of circuits and p is a constant Rent is constant (0 <= p <= 1).  Typically p is 0.12 for static memory, 0.45 for microprocessors and 0.63 for high performance computer chips.

Graph 1 shows pin-out for memory and random logic ICs showing memories requiring relatively few pins whereas random logic requires many and approximately follows Rent's Rule.  Graph 1 - Graph of number of pins (terminals) versus circuit complexity for various microelectronic functions

Graph 1 - Graph of number of pins (terminals) versus circuit complexity for various microelectronic functions

Increasing pin-out requires the package to squeeze more pins into the same or less space whilst still maintaining requirements of mechanical fragility, electrical performance and thermal specification.

3.2.1 Electrical Considerations

• Basic package electrical parasitics of resistance, inductance and capacitance present in all IC packages and can cause signal delays, signal distortion and noise.
• Self-capacitances in particular cause signal delays.
• Non-zero source resistances also increase signal delays.
• New more complex packages have reduced self-capacitances (by using improved geometry and lower dielectric constant materials) and reduced source resistances.
• Package resistance causes voltage drops and increases signal delays.
• Signal reflections are particularly troublesome causing faulty circuit operation in some cases.
• Noise generated by switching current from one chip driver can affect other drivers through inductances.
• Reduce noise by reducing inductances, restricting the total switched current, or using decoupling capacitors.
• Power distribution across a chip must be accurately controlled (<10% variation maximum) so package power lines must be designed to ensure this happens even in the event of circuit switching activity.

3.2.2 Thermal Considerations

• More complex chips make more demands on efficient heat removal from the chips.
• Silicon chips limited to approximately 100ºC for normal operation which limits power densities on chip to a maximum of 10watts/cm² in current IC packages.
• Imposes a limit average on power dissipation per individual circuit on chip of approximately 1µW/circuit for a 10 million transistor chip of area 1cm × 1 cm.
• Important to reduce power dissipation/circuit and improve package thermal design in order to produce larger, more complex ICs in the future.
• Differential thermal expansion of package parts gives rise to mechanical stresses and reliability risks.

3.3 IC Packaging Technologies

• Total package technologies in electronic products are very diverse and include ICs, PCBs, flexible circuit carriers and Multi-Chip Modules (MCMs) as shown in Table 1.

• A wide range of different materials used in packages as shown in Table 2.

Note: Kapton is a trademark of Dupont Company 

• Packaging hierarchy imposes thermal hierarchy considerations on the assembly of the total system.

3.3.1 Chip Package Connection

• Connections between the chip and package commonly performed by one of the following three technologies:
• Wirebond using thin gold or aluminium wire.
• Solder bond or Controlled Collapse Chip Connection (C4), also called flip-chip.
• Tape Automated Bonding (TAB).
• Wirebond most common, cheapest, lowest temperature but limited in the number of connections that can be made (<500) and also high lead inductance limiting electrical performance.
• C4 capable of many more connections up to 20k and low lead inductance but more complex technology and higher temperature.
• TAB gives higher number of connections than wirebond though not as high as C4, better electrical performance, high yield and lower assembly costs but highest temperature and more complex technology.

3.3.2 Chip Packages

• Chip packages are made of metal, ceramics and are either hermetically sealed or encapsulated in plastic.
• The most common types are:
  

• Their main characteristics are given in Table 3:
  

• IC packages have to:
• Provide the required number of pins for power and signals.
• Ensure thermal expansion compatibility with the chip.
• Have a thermal path for heat removal from the chip.
• Keep signal delays and noise to a minimum.
• Low dielectric constant materials used where possible to reduce signal delays.
• High thermal conductivity materials used to give good thermal properties.
• Area occupied by packages on PCB often an important concern.
• Other aspects sometimes important are burn-in ability, test, solder bond or socket to PCB and field upgradeability.
• Costs always important - Graph 3 gives a plot of cost per lead ratio versus number of pins for the common packages.

Graph 3 - Cost per lead ratio versus number of I/O pins

3.4 Package Cooling Considerations

• Despite reductions in power dissipation/individual circuit due to technology improvements, current chips contain more individual circuits/chip and so total power dissipation/chip is increasing.
• Graph 4 shows a plot of typical power dissipation per chip between 1970-1990 showing at least a tenfold increase over that period.
• Most systems use forced-air cooling of modules for package cooling.

Graph 4 - Power per chip versus year of first use

• High performance systems additionally use heat sinks mounted onto packages using various technologies.
• In extreme cases packages are further cooled by immersion in inert liquids, such as fluorocarbons.

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3.5 Package Sealing and Encapsulation

• Intended to protect the chip and package metallisation from corroding environments and from mechanical damage due to handling.
• Moisture is one of the major sources of corrosion.
• Plastic materials, such as silicones and epoxies, developed with low water diffusion properties are used extensively for IC encapsulation.
• For high reliability devices hermetic sealing used based on welding or brazing of ceramic/metal packages. More expensive and time-consuming than plastic encapsulation.

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updated 18.10.07 RA

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