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Microelectronic Technologies and Applications

Unit 1: CMOS Digital Logic - Self Assessment Answers 2



Answer 2.3 (a) Q  =  C  (VGC - VtN)

Answer 2.3 (b) Charge is negative but an extra minus sign comes from tf

Answer 2.3 (c) For p-channel, charge Q gives the extra minus sign.

Answer 2.4 Evaluate kn using method described in p44

Answer 2.5(a) gamma =

Top =     = 

Bottom =     =   34.51 x 10-4
 

  \gamma =  5.79 x 10-4    =  0.167
                        34.51 x 10-4



Answer 2.5 (b) VEN = VEON   + gamma 

If VSB = 0  ,  VtN  =  0.5  =  VEON
If VSB = 1  ,  VtN  =  0.5 + 0.5  = VtON
If VSB = 2  ,  VtN  =  0.5 + 0.5  = VtON    etc.



Answer 2.5 (c) Linear approximation to VtN above

Answer 2.5 (d) VtP  =  VtOP  - gamma 

Answer 2.5 (e) Since bulk connected to source for both transistors no back bias effects

Answer 2.6 Size  =  X  x  Y.   Use scale to get transistor sizes.

Answer 2.7 (a) Overall process yield  =  (0.9)100  =  2.6 x 10-5

Answer 2.7 (b) Overall yield 90% ; individual stage yield  =  X

then  (X)100  =  0.9
               X  = 



Answer 2.7 (c) 500 microtasks
then  X  = 

Answer 2.7 (d) Microtasks yield is 0.9998  ie.  2 mistakes in 10,000 or 1 in 5,000
5 tasks / day \  5,000 tasks in 1,000 days  ie.  around 3 years

Answer 2.7 (e) Not really.  Model assumes mistakes all equally likely to occur whereas some more likely and some less
ie.  average yield assumed.

Answer 2.12

Answer 2.12 (a)  
n well  , 200l  x  1.15K   =   70KW   etc.
                3l
  Answer 2.12 (b) Resistance of slice

 Thickness - assume 0.7mm typical
 
 

Then R  =  10 x 20         = 142W
                     20 x 0.07

Face to face  R  =  0.07 x 10  =  2.2 x 10-5W
                          3.14 x 10,000



Answer 2.14 (i) n channel ,  VtN  =  0.5v, bn  =  40 x 10-6
VGS  =  3.3v

Answer 2.14 (a) VDS  =  3.3v
VGS - VtN  =  3.3 - 0.5  =  2.8
\ VDS > VGS  - VtN  ie. saturation

\ IDS  =  bn  (VGS - VtN)2  = 40 x 10-6  (3.3 - 0.5)2  =  1568mA.
                2                                  2



Answer 2.14 (b) VDS  =  0v
\  VDS  <  VGS - VtN  ie. ohmic
then 

=  40 x 10-6 [ (3.3 - 0.5)2  -  0] 0  =  0



Answer 2.14 (c) VGS  =  0, VDS  =  3.3V
then VGS  -  VtN  =  0 - 0.5  =   -0.5     ie.  VDS  > VGS  -  VtN  ie. saturation.
hence IDS  = 40 x 10-6  (0 - (-0.5))2  =  5mA
                          2

Answer 2.15 Would not work

Answer 2.18(a) F  = 1

Answer 2.18(b) F  =  1  -  3VtN

Answer 2.18(c) S of M1  =  5V
D of M1  =  4.4V
S of M2  =  4.4V
D of M2  =  3.8V
S of M3  =  3.8V
D of M3  =  3.2V

Answer 2.18(d) If VDD  =  3V, then voltage at D of M3 will be 0.2V  - circuit will not work

Answer 2.18(e) Stops working when voltage at F ceases to be recognised as logic 1 (+2.4V)

Answer 2.21  
Ratio would be  8500  400  i.e. 21:1
p device would need to have 21:1 higher    ratio than n device to compensate.

Answer 2.23 See pages 68 + 70

Answer 2.24 C(4)  =  G(4) + P(3) G(3) + P(3) P(2) G(2) + P(1) P(3) P(2) G(1) + P(4) P(3) P(3) P(1) G(0)

C(8)  =  G(8) + P(7) G(7) + P(7) P(6) G(6)  etc. (9 terms)   See equation 2.57



Answer 2.25 See Figure 2.13

Answer 2.27 See Figure 2.13

Answer 2.28 Latch is transparent (input changes appear at the o/p in the unlatched state), flip-flop is not.

Answer 2.29 Set-up and hold times are transparent

Answer 2.30 tsu is minimum time to keep data stable prior to clock edge.
th is minimum time to keep data stable after clock edge.

Do not agree with statement from Clemenz Portmann



Answer 2.31 Diff  = 


Note: Equation 2.71 is wrong, the last term should be BIN not CIN



Answer 2.34 (a) Input voltage clamped to a voltage less than breakdown voltage - can withstand ESD because of the low amount of current involved.  If the pin was shortened to a +10v then the current and charge will be much higher and would blow the device.

(b) Again it is the current that kills - current from the mains is much higher than from static.