The key elements of a simple bare PCB and the materials used are:
This stage patterns the copper on the board surfaces by a photo-reactive method (i.e. using UV light), in order to form the circuit connectivity. This is accomplished by first applying a coating of photo resist to the surfaces in question, prior to exposure to UV light through an artwork mask. The mask is formed by a photoplotter and provides a connection pattern for one copper layer.
The technology is characterised by:
The technology is characterised by:
The three main sections within the PCB CAD toolset are:
Design entry tools enable a design to be partitioned into a number of manageable blocks that define a hierarchy from system level down to component level. System libraries allow the design to be ‘built’ on the schematic entry screen and the interconnections established. Design properties that may be used by downstream tools may also be added at this stage.
Implicit in all circuits of whatever complexity is the potential for design errors. Design verification tools enable the functionality, performance and testability of a design to be evaluated prior to fabrication and assembly. This is essential in ensuring that the design will work ‘first time’ and will remain robust and resilient in service under all operating conditions.
Defining circuit structures at the layout level is particularly
complex. A detailed knowledge of device topologies and associated
process technologies is required. Design layout tools incorporate
a set of process related design rules to ensure that the
required structures can be successfully manufactured within
the limits of the intended process technology. This stage
centres on laying out the physical component shapes on the
surface of the PCA and then routing the connections between
them.
01.02.05 RA