| Title | Electrical Circuit Theory and Technology, 2nd edition |
|---|---|
| Author | John Bird |
| ISBN | 0750657847 |
| Publisher | Newnes |
| Date | 2004 |
| Description | Electrical and electronic principles, circuit theory and electrical technology from fundamentals up to and including first degree level. Theory is kept to a minimum, and a firm emphasis is placed on problem-solving skills. |
| Title | Printed Circuit Assembly Design |
|---|---|
| Author | Leonard Marks, James A Caterina |
| ISBN | 0070411077 |
| Publisher | McGraw-Hill Education |
| Date | 2000 |
| Description | A complete “roadmap” to printed circuit assembly design. Covers both electrical and mechanical design considerations, as well as processes, tools and documentation |
| Title | High Speed Digital Design |
|---|---|
| Author | Howard W Johnson, Graham Martin |
| ISBN | 0133957241 |
| Publisher | Prentice Hall |
| Date | 1993 |
| Description | Focusing on the field of knowledge lying between digital and analog circuit theory, this text sets out to help engineers working with high speed digital systems shorten their product development cycles and help fix their latest design problems. Generally regarded as a seminal book by those working in the signal integrity field. |
| Title | Electronics Technology Handbook |
|---|---|
| Author | ed. Neil Sclater, Steve Chapman |
| ISBN | 0070580480 |
| Publisher | McGraw-Hill Education |
| Date | 1999 |
| Description | Encyclopedia-style articles covering a broad range of contemporary electronic devices, products and systems, how they work and how they interact. “Provides useful information on subjects from basic components and building block circuits to products, systems, and key manufacturing processes.” Lots of illustrations and extensive cross-references. |
| Title | †Principles of Electronic Packaging |
|---|---|
| Author | D P Seraphim, R C Laskey, C-Y Liu |
| ISBN | 0070563063 |
| Publisher | McGraw-Hill, USA |
| Date | 1989 |
| Description | This book, which results from collaboration between IBM and Cornell University, is an excellent overview of the principles of electronic packaging. It covers a lot of ground in reasonable detail, but emphasises principles and may be too mathematical for some readers. Chapters by specialists include Thermal Management, Mechanical Design, Reliability and Testing. Most of the chapters contain self-assessment questions, but regrettably no answers! |
| Title | †Design Guidelines for Surface Mount and Fine Pitch Technology: 2nd edn |
|---|---|
| Author | Vern Solberg |
| ISBN | 0070595771 |
| Publisher | McGraw-Hill, New York |
| Date | 1996 |
| Description | Focuses on cost-effective design for SM assemblies, including fine pitch devices and BGAs. |