This list is of resources that were consulted during the preparation of module AMI4982 Lead-free implementation, with the exception of the first item which promised well but has slipped from its intended 2003 publication date. It is not a complete list, but certainly represents a selection of the best material. Most items will be available from libraries, but remember that this is a reference list rather than intended to support your daily studies.
Be aware that many general text books on PCBs and soldering, such as Coombs’ Printed Circuits Handbook, also contain relevant information.
| Title | Implementing Lead-Free Solder in Electronics Manufacturing |
|---|---|
| Author | Edwin Bradley, Carol Handwerker, John E.Sohn |
| ISBN | 0471448877 |
| Publisher | John Wiley & Sons Inc |
| Date | |
| Description | When it eventually becomes available (2006?), this promises to be a highly relevant text. |
| Title | Lead-free electronics: 2004 edition |
|---|---|
| Author | ed. Sanka Ganesan and Michael Pecht |
| ISBN | 0970717474 |
| Publisher | CALCE EPSC Press |
| Date | 2003 |
| Description | This book attempts to tackle key questions confronting the industry
such as the costs involved in going lead-free, the technical issues,
the risks for high reliability applications, and supply chain concerns.
The first chapter provides an overview, with a snapshot of lead-free
electronics migration in Japan in the final chapter. Of the remaining nine chapters, two cover business issues and the remainder technology aspects. As the sections are written by a large number of contributors, styles vary, but this is generally a comprehensive review. I found the sections on conductive adhesives and intellectual property particularly useful. The basic metallurgy in earlier chapters is pretty dry, but overall this is a cost-effective reference, available direct from the publishers. Reviewed at http://www.smartgroup.org/books/leadfree2004.htm. |
| Title | Environmental-Friendly Electronics: Lead-Free Technology |
|---|---|
| Author | Jennie S. Hwang |
| ISBN | 0901150401 |
| Publisher | Electrochemical Publications |
| Date | 2001 |
| Description | As always with this publisher, the emphasis is on solid information
presented in a multiplicity of sections and sub-sections, so this
is not an easy read. It is also very heavy and quite expensive –
my money would be on the books by Puttlitz and Suganuma. However,
there is a great deal of information on the quaternary systems favoured
by Dr Hwang and some of the later chapters, contributed by many of
the ‘great and good’ of the soldering establishment bear
reading. A short chapter “Perspectives and views” provides
an interesting snapshot of views from 3–4 years ago and will
doubtless be of interest to historians. Reviewed at http://www.smartgroup.org/books/efe.htm |
| Title | Implementing Lead-free Electronics |
|---|---|
| Author | Jennie S Hwang |
| ISBN | 0071443746 |
| Publisher | McGraw-Hill Education |
| Date | 2005 |
| Description | Reviewed at http://www.smartgroup.org/books/ilfe.htm |
| Title | Electronics Manufacturing with Lead-Free, Halogen Free & Conductive Adhesive Materials |
|---|---|
| Author | John Lau, Ricky Lee, Ning Chang Lee and Wong |
| ISBN | 0071386246 |
| Publisher | McGraw-Hill Education |
| Date | 2002 |
| Description | This book struggled through several alternative titles during its
development and combines a number of different topics. The introduction
takes a general environmental perspective that is refreshing; and
the remaining material is organised as: • four chapters on making chip bump connections either with lead-free solder or with a variety of stud bumps • five chapters looking at the materials for IC moulding and packaging • three chapters on printed wiring board, looking at green manufacture as well as the issues of conformal coating and bromine compounds for flame retardancy • three chapters on lead-free solder alloys • a chapter each on lead-free surface finishes, implementing lead-free soldering and lead-free challenges • four chapters on aspects of conductive adhesives. The first of these sections is by far the heaviest, and the rest all have some merits. Unfortunately the poor quality of production means that the illustrations are far from crisp. Reviewed at http://www.smartgroup.org/books/em.htm |
| Title | Structural Integrity and Reliability in Electronics: Enhancing Performance in a Lead-free Environment |
|---|---|
| Author | W.J. Plumbridge, R.J. Matela (Editor), A. Westwater (Editor) |
| ISBN | 1402017650 |
| Publisher | Kluwer Academic Publishers |
| Date | 2003 |
| Description | This is a book of three parts, covering The materials perspective,
The manufacturer’s perspective and The designer’s perspective,
and the level of content and style is equally different. Unless they
come from a physics or materials background, most students will find
Part 1 heavy going and Part 3 very mathematical. Angus Westwater’s
contribution in the middle of the sandwich is much more readable –
nothing much new, but a good summary of many of the reliability issues
from the perspective of someone who has actually been involved with
components. Reviewed at http://www.smartgroup.org/books/struc.htm. |
| Title | Handbook of Lead-Free Solder Technology for Microelectronic Applications |
|---|---|
| Author | Karl J. Puttlitz and Kathleen A. Stalter |
| ISBN | 0824748700 |
| Publisher | Marcel Dekker Inc |
| Date | 2004 |
| Description | This is a large book at a serious price that arose from the authors’
task of implementing lead-free products at IBM, and that has the aim
of being a single source covering all key aspects. There is solid
material on the background and driving forces, with a wide environmental
perspective, followed by substantial amounts of detail on materials
and manufacturing, contributed by industry experts. The final section
of reliability aspects covers a broad front, and the treatment is
practical rather than overly mathematical. There is a good balance
of material, and I found the chapters on lead-free component conversion
and international solder studies helpful. Reviewed at http://www.smartgroup.org/books/ma.htm. |
| Title | Lead-Free Soldering in Electronics: Science, Technology and Environmental Impact |
|---|---|
| Author | ed. Katsuaki Suganuma |
| ISBN | 0824741021 |
| Publisher | Marcel Dekker |
| Date | 2003 |
| Description | A slim book, with some really valuable sections such as clear material
on tin whiskers and electricochemical migration. However, there are
noticeable deficiencies in the sub-editing of material from non-native
speakers, and insufficient editorial attention to the balance between
chapters. For example, it would have been nice to have something more
extended on wave soldering. Reviewed at http://www.smartgroup.org/books/lfh.htm. |