Selected reading material
Materials science and applications
This listing of books contains both introductions to engineering materials at a fundamental level and more practical treatises, showing how basic materials are employed within an electronic manufacturing framework. It includes some key books that describe how printed circuits and semiconductors are made, and the book by Coombs is commended as something you may wish to own, although unfortunately there are no plans to update it.
Be aware that, despite the fact that many of these books appear at first sight to be the work of a single author, in practice the range of topics covered is so wide that many books are actually compilations of submissions by a number of specialist authors. The degree to which the material has been edited during assembly varies widely, with the result that some books have avoidable duplication.
| Title |
†Plastics for Electronics: Materials, Properties & Design Applications |
| Author |
William M Alvino |
| ISBN |
0070014353 |
| Publisher |
McGraw-Hill, New York |
| Date |
1995 |
| Description |
“Alvino covers all aspects of plastics electronics, their properties, how they are used and the trade-offs between the use of different polymers.” One of the best summaries of the subject:
Chapter 2 on fundamentals and methods of polymerisation
Chapter 7 on methods of processing |
| Title |
†Materials Selection in Mechanical Design |
| Author |
M F Ashby |
| ISBN |
0080419070 |
| Publisher |
Pergamon, Oxford |
| Date |
1992 |
| Description |
Concentrates on the design process, and contains a number of case studies to illustrate all aspects of materials selection. Ch.3 explains the mechanical engineering terms used, Ch.4 gives enlightenment on the characteristics of a very wide range of materials, and Appendix B is a set of useful solutions to standard problems. |
| Title |
The Science and Engineering of Materials (2nd SI edition) |
| Author |
Donald R Askeland |
| ISBN |
041234260X |
| Publisher |
Chapman & Hall, London |
| Date |
1990 |
| Description |
Very wide coverage, from basic structure to engineering properties, with an emphasis on selection and test. Includes worked questions. |
| Title |
Engineers Handbook of Encapsulation and Underfill Technology |
| Author |
Martin Bartholomew |
| ISBN |
090115038X |
| Publisher |
Electrochemical Publications |
| Date |
1999 |
| Description |
Reviewed at http://www.smartgroup.org/books/eheut.htm. |
| Title |
Technology of Engineering Materials |
| Author |
W Bolton, M. Philip |
| ISBN |
0750656433 |
| Publisher |
Butterworth-Heinemann, London |
| Date |
2002 |
| Description |
Its predecessor (Engineering Materials Technology) was a very approachable explanation of basic materials structure, properties and fabrication methods. |
| Title |
Engineering Science, 4th edn |
| Author |
W Bolton |
| ISBN |
0750652594 |
| Publisher |
Butterworth-Heinemann |
| Date |
2001 |
| Description |
A student-centered text, with numerous examples, problems, activities and experiments, which covers electrical principles and mechanical principles in the same volume as core engineering science. |
| Title |
Ceramic Materials for Electronics |
| Author |
ed. Relva C Buchanan |
| ISBN |
0824740289 |
| Publisher |
Marcel Dekker Ltd |
| Date |
2004 |
| Description |
Studies a wide range of ceramic materials, including insulators, conductors, piezoelectrics, and ferroelectrics, through detailed discussion of their properties, characterization, fabrication, and applications in electronics. |
| Title |
Special Polymers for Electronics and Opto-electronics |
| Author |
ed. J A Chilton & M T Goosey |
| ISBN |
041258400X |
| Publisher |
Chapman & Hall, London |
| Date |
1995 |
| Description |
Latest information, with enough chemistry to look convincing. |
| Title |
Coombs’ Printed Circuits Handbook: 5th edn |
| Author |
ed. Clyde F Coombs Jr |
| ISBN |
0071350160 |
| Publisher |
McGraw-Hill, New York |
| Date |
2001 |
| Description |
Exhaustively covers every facet of printed circuit assemblies. Latest edition reflects major changes in miniaturisation of printed circuits, with completely new sections on design, fabrication, and assembly.
Reviewed at http://www.smartgroup.org/books/pcbm.htm. |
| Title |
Area Array Packaging Materials: Adhesives, Pastes and Lead-free |
| Author |
Ken Gilleo |
| ISBN |
0071428283 |
| Publisher |
McGraw-Hill Higher Education |
| Date |
2003 |
| Description |
Dr Ken Gilleo is an industry guru with a particular interest in materials who has brought together an interesting compilation, mostly with the aid of colleagues from Cookson and related companies. The most extended of these contributions, by Jenny Hwang on solder paste is not particularly new, but the overviews on packaging materials and methods and the use of electrically-conductive adhesives for solder replacement are worth browsing, if not buying. |
| Title |
Handbook of Plastics, Elastomers, and Composites, 4th edn |
| Author |
ed. Charles A Harper, Ken McCombs |
| ISBN |
0071384766 |
| Publisher |
McGraw-Hill Education |
| Date |
2002 |
| Description |
|
| Title |
Electronic Packaging and Interconnection Handbook, 3rd edn |
| Author |
Charles A Harper |
| ISBN |
0071347453 |
| Publisher |
McGraw Hill Education |
| Date |
2000 |
| Description |
review at http://www.smartgroup.org/books/epih.htm |
| Title |
High Performance Printed Circuit Boards |
| Author |
Charles A Harper |
| ISBN |
0070267138 |
| Publisher |
McGraw-Hill Education |
| Date |
1999 |
| Description |
Data and design information for the new generation fast, dense boards and substrates. Covers microvias, built-up multilayers, and high density boards, advanced ceramic substrates, and environmentally-safe materials.
Reviewed at http://www.smartgroup.org/books/hppcb.htm. |
| Title |
†Fundamentals of Materials Science for Technologists |
| Author |
Larry Horath |
| ISBN |
0023571616 |
| Publisher |
Prentice Hall, New Jersey |
| Date |
1995 |
| Description |
Covers a very wide range of materials at a modest level, and aimed at mechanical engineers. |
| Title |
Printed Circuit Board Materials Handbook |
| Author |
ed. Martin W Jawitz |
| ISBN |
0070324883 |
| Publisher |
McGraw-Hill, New York |
| Date |
1997 |
| Description |
Contains a substantial amount of material on fabrication processes as well as materials, with sections on troubleshooting and failure analysis. Subjects are dealt with in a great deal of detail, but the book is less application-orientated than Coombs. |
| Title |
Introduction to the Electronic Properties of Materials, 2nd edn |
| Author |
David Jiles |
| ISBN |
0748760423 |
| Publisher |
CRC Press |
| Date |
2001 |
| Description |
The 1st edition was a useful book arranged in three fairly comprehensive but not over-long sections: Fundamentals of electrons in materials; Properties of materials; Applications of electronics materials. |
| Title |
Electroplating: Basic Principles, Processes and Practice |
| Author |
Nasser Kanani |
| ISBN |
1856174514 |
| Publisher |
Elsevier Advanced Technology |
| Date |
2004 |
| Description |
|
| Title |
Conductive adhesives for electronics packaging |
| Author |
ed. Johan Liu |
| ISBN |
0901150371 |
| Publisher |
Electrochemical Publications, Isle of Man |
| Date |
1999 |
| Description |
Reviewed at http://www.smartgroup.org/books/caep.htm. |
| Title |
†Plastics: Microstructure and Engineering Applications: 2nd edn |
| Author |
Nigel Mills |
| ISBN |
0340560436 |
| Publisher |
Edward Arnold, Sevenoaks |
| Date |
1993 |
| Description |
Covers polymer structures, processing and applications, with some underpinning science and engineering, as a foundation for the analysis and design of plastic products. Numerous micrographs and fracture surface photos, and information on composites.
3rd edition (ISBN 0750651482) due September 2005. |
| Title |
†Characterization of integrated circuit packaging materials |
| Author |
Thomas M Moore and Robert G McKenna |
| ISBN |
0750692677 |
| Publisher |
Butterworth-Heinemann, Boston |
| Date |
1993 |
| Description |
One of the more approachable textbooks with a full coverage of reliability issues and an extensive appendix summarising materials test techniques. |
| Title |
Modern Ceramic Engineering: Properties, Processing, and Use in Design, 2nd edn |
| Author |
David W Richerson |
| ISBN |
0824786343 |
| Publisher |
Marcel Dekker, New York |
| Date |
1992 |
| Description |
Three sections on structures and properties, processing and design. Emphasises diverse application of ceramics. Well illustrated and packed with references. |
| Title |
The Multilayer Printed Circuit Board Handbook |
| Author |
John A Scarlett |
| ISBN |
0901150150 |
| Publisher |
Electrochemical Publications, Ayr |
| Date |
1985 |
| Description |
|
| Title |
Introduction to Materials Science for Engineers, 6th edn |
| Author |
James F Shackelford |
| ISBN |
0131276190 |
| Publisher |
Prentice-Hall, New Jersey |
| Date |
2004 |
| Description |
Physical properties and applications of all the major categories of engineering materials, and not just “a focus on metallurgy with tacked-on treatment of non-metallic materials”. Contains “an abundance of problems and exercises” (!) as well as one-page case studies throughout the text and extensive data tables. |
| Title |
Microchip Fabrication: A practical guide to semiconductor processing,
4th ed. |
| Author |
Peter van Zant |
| ISBN |
0071432418 |
| Publisher |
McGraw-Hill, New York |
| Date |
2004 |
| Description |
Straightforward approach to every aspect of manufacturing semiconductors. Covers history to the latest technology. Helpfully free of mathematics!
Reviewed at http://www.smartgroup.org/books/microfab.htm. |
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