Selected reading material
Packaging
This group of books falls into two types: books that review the options available for semiconductor assembly, and those that deal with specific techniques and approaches.
| Title |
Chip Scale Packaging for Modern Electronics |
| Author |
Joseph Fjelstad, Reza Ghaffarian, Young-Gon Kim |
| ISBN |
0901150436 |
| Publisher |
Electrochemical Publications |
| Date |
2003 |
| Description |
Reviewed at http://www.smartgroup.org/books/csp2.htm |
| Title |
†Multi-chip Module Technology Handbook |
| Author |
Philip E Garrou and Iwona Turlik |
| ISBN |
0070228949 |
| Publisher |
McGraw-Hill, New York |
| Date |
1997 |
| Description |
Ch 8 Assembly and Ch14 Known Good Die are particularly relevant |
| Title |
†Electronic Equipment Packaging Technology |
| Author |
Gerald L Ginsberg |
| ISBN |
0442238185 |
| Publisher |
Van Nostrand Reinhold, New York |
| Date |
1992 |
| Description |
With a minimum of theory, Ginsberg goes from basic package elements to the design, materials selection, and process implementation for low-cost, high-performance packaging, relating technology to final product performance. Information on value analysis, testing, life-cycle costing and system integration. |
| Title |
†Multichip Modules and Related Technologies: MCM, TAB and COB Design |
| Author |
Gerald L Ginsberg & Donald P Schnorr |
| ISBN |
007023552X |
| Publisher |
McGraw-Hill, New York |
| Date |
1994 |
| Description |
Chapter 1 on driving forces and Chapter 2 on general considerations are a good summary. Explains the various options well, with many comparison tables. |
| Title |
Wire Bonding in Microelectronics: Materials, Processes, Reliability and Yield |
| Author |
George G Harman |
| ISBN |
0070326193 |
| Publisher |
McGraw-Hill, New York |
| Date |
1997 |
| Description |
Originally entitled Reliability and Yield Problems of Wire Bonding in Microelectronics: The Application of Materials and Interface Science, this is a classic ‘fruits of experience’ book on what can go wrong and how to stop it, and is highly recommended by wire bond practitioners. The book has been substantially rewritten and extended to include coverage of new materials, alternative techniques, fine pitch bonding, MCMs and chip-on-board. |
| Title |
Electronic Packaging and Interconnection Handbook: 3rd edn |
| Author |
ed. Charles A Harper |
| ISBN |
0071347453 |
| Publisher |
McGraw-Hill, New York |
| Date |
2000 |
| Description |
Covers the industry from design to test, with much material on new generation packaging technologies such as multichip modules and ball grid arrays.
Reviewed at http://www.smartgroup.org/books/epih.htm. |
| Title |
Ball Grid Array & Fine Pitch Peripheral Interconnections: A Handbook of Technology & Applications for Microelectronics/Electronics Manufacturing |
| Author |
Jennie S Hwang |
| ISBN |
0901150290 |
| Publisher |
Electrochemical Publications, Isle of Man |
| Date |
1995 |
| Description |
|
| Title |
Ball Grid Array Technology |
| Author |
ed. John H Lau |
| ISBN |
007036608X |
| Publisher |
McGraw-Hill, New York |
| Date |
1995 |
| Description |
|
| Title |
Chip Scale Package: Design Materials, Process, Reliability, and Applications |
| Author |
ed. John H Lau and S W (Ricky) Lee |
| ISBN |
0070383049 |
| Publisher |
McGraw-Hill, New York |
| Date |
1999 |
| Description |
An introductory chapter on basic joining techniques is followed by 36 chapters each covering a major type of CSP developed by the main vendors. These are grouped by the basic type of construction, usually the platform on which the CSP is built, viz. customised leadframe; flexible substrate; rigid substrate; wafer-level redistribution. Compares both technology and cost-effectiveness of different packages in varying applications. |
| Title |
†Electronic Packaging: Design, Materials, Process and Reliability |
| Author |
John H Lau, C P Wong, John L Prince and Wataru Nakayama |
| ISBN |
0070371350 |
| Publisher |
McGraw-Hill, New York |
| Date |
1998 |
| Description |
Of variable quality, with an emphasis on thermal and mechanical design, but Ch.2 (Basic electrical effects) and Ch.5 (Polymers for electronic packaging) are useful summaries. |
| Title |
Flip Chip Technologies |
| Author |
ed. John H Lau |
| ISBN |
0070366098 |
| Publisher |
McGraw-Hill, New York |
| Date |
1996 |
| Description |
Comprehensive reference covering design, engineering, and manufacturing. |
| Title |
Low cost flip chip technologies for DCA, WLCSP and PBGA assemblies |
| Author |
John H Lau |
| ISBN |
0071351418 |
| Publisher |
McGraw-Hill, New York |
| Date |
2000 |
| Description |
Lau’s usual comprehensive treatment applied to a key subject. First half covers generic issues such as bumping, high-density substrates, lead-free materials and underfill; second half gives extended treatment to six packaging solutions.
Reviewed at http://www.smartgroup.org/books/lcfc.htm. |
| Title |
Handbook of Tape Automated Bonding |
| Author |
ed. John H Lau |
| ISBN |
0442004273 |
| Publisher |
Van Nostrand Reinhold, New York |
| Date |
1992 |
| Description |
Comprehensive set of papers which cover all related topics: elements of most use are Ch.3 on cost/benefits, Ch.11 on polymer encapsulation and Ch.16 on interconnection substrates. |
| Title |
†Multichip Module Design, Fabrication and Testing |
| Author |
ed. James J Licari |
| ISBN |
0070377154 |
| Publisher |
McGraw-Hill, USA |
| Date |
1995 |
| Description |
Describes MCM technology, as well as showing designers how to use it in practice, and covers practical issues such as testing, rework procedures and failure modes and mechanisms. Good basic reference book, which is particularly strong on substrate materials and thermal management. |
| Title |
†Plastic-encapsulated Microelectronics:
Materials, Processes, Quality, Reliability and Applications |
| Author |
ed. Michael G Pecht, Liu T Nguyen & Edward B Hakim |
| ISBN |
0471306258 |
| Publisher |
Wiley Inter-Science, New York |
| Date |
1995 |
| Description |
Pecht and his colleagues at the University of Maryland have produced a book which is both the dread and envy of every course writer! Dread, because the topic is covered very comprehensively, almost doing away with the need to write course notes; envy, because the material is well presented and makes it reasonably clear as to which of the range of processes is preferred, and why. If you ever have to make plastic encapsulated semiconductor components ‘for real’, then this is the book to buy! Destined to be a classic of reference, in the same way as John Lau’s book on fine pitch surface mount. Its comprehensive coverage includes a full set of references, but these do not obscure the text, and there is no unnecessary theory. Chapter 2, which deals comprehensively with materials, is particularly useful. |
| Title |
Area Array Interconnection Handbook |
| Author |
ed. Karl Puttlitz and Paul A Totta |
| ISBN |
0792379195 |
| Publisher |
Kluwer Publishing |
| Date |
2001 |
| Description |
Reviewed at http://www.smartgroup.org/books/aaih.htm |
| Title |
Microelectronics Packaging Handbook:
Part I Technology Drivers
Part II Semiconductor Packaging
Part III Subsystem Packaging |
| Author |
ed. Rao R Tummula, Eugene J Rymaszewski and Alan G Klopfenstein |
| ISBN |
0412084317; 0412084414; 0412084511 |
| Publisher |
Kluwer Academic Publishers |
| Date |
1997 |
| Description |
2nd edition of 1989 handbook, now in three parts. |
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