Selected reading material
Soldering
Soldering is a subject that has attracted much attention and literature over the past century, in consequence of its importance to electronics. You will probably find Klein Wassink’s classic on your library shelves; if you want to buy more current books, those by Manko and Lee are worth adding to your collection.
| Title |
Soldering in Electronics Assembly: 2nd edn |
| Author |
Keith Brindley and Mike Judd |
| ISBN |
0750635452 |
| Publisher |
Butterworth-Heinemann, Oxford |
| Date |
1999 |
| Description |
|
| Title |
†Solder Mechanics: a state of the art assessment |
| Author |
ed. D R Frear, W B Jones and K R Kinsman |
| ISBN |
0873391667 |
| Publisher |
Minerals, Metals & Materials Society, Warrendale, Pa |
| Date |
1990 |
| Description |
|
| Title |
†Solder Paste in Electronics Packaging: Technology and Applications in Surface Mount, Hybrid Circuits and Component Assembly |
| Author |
Jennie S Hwang |
| ISBN |
0442207549 |
| Publisher |
Van Nostrand Reinhold, New York |
| Date |
1989 |
| Description |
|
| Title |
Modern Solder Technology for Competitive Electronics Manufacturing |
| Author |
Jennie S Hwang |
| ISBN |
0070317496 |
| Publisher |
McGraw-Hill, New York |
| Date |
1996 |
| Description |
“Fundamental principles and practical execution” covering all solder application technologies. |
| Title |
Cleaning Printed Wiring Assemblies in Today’s Environment |
| Author |
ed. Les Hymes |
| ISBN |
0442002750 |
| Publisher |
Kluwer Academic Publishers |
| Date |
1991 |
| Description |
Deals with the challenge of producing assemblies free of detrimental residues whilst using environmentally acceptable manufacturing techniques. |
| Title |
Soldering in Electronics: A comprehensive treatise on soldering technology for surface mounting and through-hole technologies: 2nd edn |
| Author |
R J Klein Wassink |
| ISBN |
090115024X |
| Publisher |
Electrochemical Publications, Isle of Man |
| Date |
1989 |
| Description |
Despite its age, this is still a key text, which takes a system view of its subject. In-depth background theory (on topics such as wetting and dewetting, thermal influences, solderability, metallurgy and process conditions) plus practical information on soldering alloys, fluxes, coatings, soldering methods, pattern design, joint reliability and criteria for joint inspection. |
| Title |
Solder Paste in Electronics Packaging |
| Author |
R J Klein Wassink and M M F Verguld |
| ISBN |
0901150304 |
| Publisher |
Electrochemical Publications, Isle of Man |
| Date |
1995 |
| Description |
|
| Title |
Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies |
| Author |
John H Lau and Yi-Hsin Pao |
| ISBN |
0070366489 |
| Publisher |
IMAPS |
| Date |
1996 |
| Description |
A ‘one-stop guide to the state of the art of solder joint reliability’ of BGA, CSP, flip chip, and fine pitch assemblies, from the theoretical basics to applications. Covers joint reliability problem-solving methods, and the design of robust, high-yield manufacturing processes for interconnect systems. |
| Title |
Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP and Flip Chip Technologies |
| Author |
Ning-cheng Lee |
| ISBN |
0750672188 |
| Publisher |
Newnes (Butterworth-Heinemann) |
| Date |
2002 |
| Web Review |
I share the enthusiasm shown by Bob Willis in his review at http://www.smartgroup.org/books/ning.htm. |
| Title |
Solders and Soldering, 4th edition |
| Author |
Howard H Manko |
| ISBN |
0071344179 |
| Publisher |
McGraw-Hill, New York |
| Date |
2001 |
| Description |
Another soldering classic: “You can’t work in electronics without solder – and you shouldn’t work with solder without . . . this book by the world’s top solder educator . . . the leader in its field for two decades”.Comprehensive coverage of soldering methods, and the strengths and weaknesses of each for varying applications.
Reviewed at http://www.smartgroup.org/books/sold.htm. |
| Title |
The Basics of Soldering |
| Author |
Armin Rahn |
| ISBN |
0471584711 |
| Publisher |
John Wiley & Sons, New York |
| Date |
1993 |
| Description |
Practical experience of solder technologies for through-hole and SM, including cleaning and SPC. Focus on the complex interrelations of process parameters. |
| Title |
The Mechanics of Solder Alloy Wetting and Spreading |
| Author |
ed. Frederick G Yost, F Michael Hosking & Darrel R Frear |
| ISBN |
0442017529 |
| Publisher |
Van Nostrand Reinhold, New York |
| Date |
1993 |
| Description |
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| ISBN |
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