This is not just a question of reviewing the last unit, but of remembering what was said earlier! FR-4 is not ideal for mounting components for two reasons:
Being flexible, it will bend during assembly processes such as placement and depanelling, which can over-stress fragile components such as MLCs
There is usually a CTE mismatch between the board and the components mounted on it, which results in stress during temperature cycling, possibly leading to joint or component failure.
Where large, repeated temperature excursions are expected, the
design should avoid specifying large, rigid components or potted
modules, in favour of using parts with compliant leads, such as
QFPs. Where this cannot be done, consideration should be given to
choosing an alternative substrate material with a better CTE match.
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