Solder paste losses

Solder paste losses occur through:

• solder paste which is removed from the stencil and squeegee blades after completion of the batch or shift, and cannot be used because it has changed viscosity
• misprints, which are ‘wiped’ and reprinted
• ‘ends’ of jars and syringes which are not used, or are exposed to air and consequently dry up.

Your company’s consumption of solder paste may be higher than you think. If you are able, try and assess the efficiency of paste usage, by weighing samples both before and after printing, and comparing your estimate of the solder paste used with the amount issued from stores. Focusing on this issue has saved some companies very substantial amounts of money. Remember that such savings go straight to the bottom line!

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