The basic toolkit would comprise:
The thermal demand of the motherboard is likely to be high, as a consequence of which it might be necessary to apply background heat during repair.
Although it is possible to repair the board itself, for example to deal with lifted pads, it is probably not cost-effective to do this, unless the motherboard is exceptionally expensive.
A subsidiary item of equipment that might be helpful is some means of reballing the BGA package, assuming that a device problem is with the solder joint rather than the integrated circuit itself. However, this is a specialised operation that is probably best carried out by experienced contractors.