Your table might look something like this:
| Alternative approach | benefits | disadvantages |
|---|---|---|
| alternative solvent process | no change to existing process; may be able to convert CFC cleaning equipment | use of HCFCs and VOCs costly and likely to be restricted |
| semi-aqueous process | no change to existing process | needs new equipment; potential effluent problem |
| aqueous process | provides cosmetically clean board; makes it possible to use more active fluxes | needs new flux type; needs new equipment; potential effluent problem |
| no-clean/no-residue flux | no need for any cleaning equipment | for the user:needs new flux type; may need inert atmosphere soldering; narrow process window for the flux manufacturer: needs fundamental flux redesign; problems with cosmetic quality, pin testability and solder balling |
[ back to top ]